HDI PCB 6 Layer Blue Solder Mask Immersion Gold Treatment 1.0 MM Thickness
PCB Specifications:
1 Part NO: HDIPCB0008
2 Layer Count: 6 Layer HDI PCB
3 Finished Board Thickness: 1.0MM
4 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM
5 Min Lind Space&Width: 2.8/3.6mil
6 Copper Thickness: 1/1/1/1/1/1
7 Application Area: Consumder Electronics
8 PCB Size: 140.86MM*108.71MM/2PCS
Our production applications:
1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.
2 Industrial control:main boards in machines, industrial robots, servo motors etc.
3 Automotive: BMS main boards, automotive radar etc.
4 Power supplies: UPS, industrial power supply, frequency power supply.
5 Medical: medical equipment, medical equipment power supply.
6 Communication products: 5G base station, routers, satellites, antennas.
Our Product Categories:
| Our Product Categories |
| Material Kinds |
Layer Counts |
Treatments |
| FR4 |
Single Layer |
HASL Lead Free |
| CEM-1 |
2 Layer/Double Layer |
OSP |
| CEM-3 |
4 Layer |
Immersion Gold/ENIG |
| Aluminum Substrate |
6 Layer |
Hard Gold Plating |
| Iron Substrate |
8 Layer |
Immersion Silver |
| PTFE |
10 Layer |
Immersion Tin |
| PI Polymide |
12 Layer |
Gold fingers |
| AL2O3 Ceramic Substrate |
14 Layer |
Heavy copper up to 8OZ |
| Rogers, Isola high frequency materials |
16 Layer |
Half plating holes |
| Halogen free |
18 Layer |
HDI Laser drilling |
| Copper based |
20 Layer |
Selective immersion gold |
| |
22 Layer |
immersion gold +OSP |
| |
24 Layer |
Resin filled in vias |
Product Tags:
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Blue Solder Mask HDI PCB 6 Layer Immersion Gold Enig 1.0 MM Images
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